Patent · US Expired

RF sputtering apparatus having floating anode shield

US4131533A · kind A · utility

44Cited by

5References

16Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Joseph A. Bialko · Wappingers Falls, US
John S. Lechaton · Wappingers Falls, US

Key dates

Filing date	Dec 30, 1977
Grant date	Dec 26, 1978
Priority date	—
Expiry date	Dec 30, 1997

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC23C14/34
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

Isolating the anode shield of RF sputtering apparatus from the ground potential reduces the grounded surfaces to which the plasma is exposed and thereby increases the impedance between the plasma and the grounded surfaces. This improvement increases the resputtering rate significantly before the operating point of instability in the system is reached.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.