Radiation cured, high temperature adhesive composition
US4133731A · kind A · utility
41Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 3, 1978 |
| Grant date | Jan 9, 1979 |
| Priority date | — |
| Expiry date | Mar 3, 1998 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31909
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A cured adhesive composition possessing excellent cohesive strength at high temperatures along with excellent adhesion, shear strength and solvent resistance is prepared by the radiation initiated curing of an adhesive composition comprising a monoalkenyl arene/conjugated diene block copolymer, tackifying resin and a di-to-tetra-functional acrylate or methacrylate selected from the group consisting of acrylic and methacrylic acid esters of polyols.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.