Terminal connections on microcircuit chips
US4134801A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 12, 1978 |
| Grant date | Jan 16, 1979 |
| Priority date | — |
| Expiry date | Apr 12, 1998 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12722
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing an elementary slice provided with a microcircuit and having terminal connections in the form of metallic bumps which ensure the connection of the microcircuit to external circuitry. A major slice is provided in which a number of elementary slices are formed which adjoin each other along future severing lines. Lands are provided on which to grow metallic bumps. In order to be able to electrolytically grow the metallic bumps on the lands, the latter are series-connected together and to a voltage source by conductive strips which extend in a zig-zag manner over the severing lines. After the growth process the electric connections between the lands are automatically interrupted when the slice is severed into elementary slices. The most important application of the invention lies in the field of manufacturing elementary slices with bubble domain handling structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.