Nitrogen and sulfur compositions and acid copper plating baths
US4134803A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 1977 |
| Grant date | Jan 16, 1979 |
| Priority date | — |
| Expiry date | Dec 21, 1997 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/38
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Nitrogen and sulfur compositions are described which are useful in aqueous acidic plating baths and processes for electrodepositing bright and level copper coatings. The compositions are prepared by reacting a mixture of PA1 (a) a disulfide having the formula EQU [RR'NCS.sub.2 ].sub.2 (Formula I) PA1 wherein R and R' are each independently hydrogen, alkyl or aryl groups, and PA1 (b) a halo hydroxy sulfonic acid having the formula EQU X(CH.sub.2).sub.n CHOH--CH.sub.2 SO.sub.3 M (Formula II) PA1 wherein X is a halogen, n is one or two and M is hydrogen or an alkali metal, in PA1 (c) an aqueous alkaline medium. Particularly bright and level deposits are obtained when the reaction mixture used to form the composition also contains an aliphatic aldehyde containing up to three carbon atoms. The presence of the above-described brightening and leveling agents in acid copper plating baths produces a lustrous, smooth and level deposit of copper over a wide range of current densities, particularly when wetting agents are included in the plating baths.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.