Centering device for automatic placement of chip components in hybrid circuits
US4135630A · kind A · utility
54Cited by
2References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 8, 1977 |
| Grant date | Jan 23, 1979 |
| Priority date | — |
| Expiry date | Dec 8, 1997 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device for centering chip components attached to the tip of a pick and place spindle after selection from storage and prior to placement on a substrate. The need for precisely stored component chips is eliminated. A vacuum in the hollow spindle tip holds the component chip, while, in turn, cam-driven feet and fingers attached to the spindle housing push the component chip to a centered position on the spindle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.