Bath and method for electroplating tin and/or lead
US4135991A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 12, 1977 |
| Grant date | Jan 23, 1979 |
| Priority date | — |
| Expiry date | Aug 12, 1997 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/60
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An aqueous acid plating bath for electrodeposition of tin, lead or tin-lead alloys on a substrate is described and comprises at least one metal salt selected from the group consisting of a stannous salt, a lead salt or a mixture of stannous and lead salts, and as a brightener agent, an effective amount of at least one alkoxylated amine of the formula ##STR1## wherein R is a fatty acid alkyl group containing from about 8 to about 22 carbon atoms, PA1 R.sup.1 is an alkylene radical containing up to about 5 carbon atoms, PA1 R.sup.2 and R.sup.3 are each independently an ethylene or propylene group, PA1 A is 0 or 1, and PA1 X, y and z are each independently integers from 1 to about 30, and the sum of x, y, and z is an integer of from about 2 to about 50. Methods for the electrodeposition of tin, lead, or tin-lead alloys from such baths as well as additive compositions for forming the baths also are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.