Composition, plating bath, and method for electroplating tin and/or lead
US4139425A · kind A · utility
20Cited by
2References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 5, 1978 |
| Grant date | Feb 13, 1979 |
| Priority date | — |
| Expiry date | Apr 5, 1998 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/60
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A composition is described which is useful particularly in improving the electrodeposition of tin, lead or tin-lead from an aqueous acidic plating bath. The new composition comprises a reaction product of an unsaturated nitrogen-containing heterocyclic compound with a mixture comprising formaldehyde and an unsaturated aliphatic aldehyde containing up to about six carbon atoms. Aqueous acidic plating baths containing the additive compositions of the invention, and methods for depositing tin, lead or tin-lead alloys from such baths as well as additive compositions for forming the baths also are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.