Thermosetting resin composition
US4140664A · kind A · utility
11Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 6, 1977 |
| Grant date | Feb 20, 1979 |
| Priority date | — |
| Expiry date | Sep 6, 1997 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D133/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An aqueous solution or dispersion of thermosetting resin comprising a resin, dissolved or dispersed in water in an amount of 5 to 85% by weight, said resin being obtained by solution polymerization of a mixture comprising (1) at least one polymerizable monomer having an amphoteric ion structure, (2) at least one polymerizable monomer containing a carboxyl group and (3) at least one of other polymerizable monomers in a hydrophilic organic solvent and has a number average molecular weight of 1,000 to 30,000 and a glass transition point of -30 to +80.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.