Hot-melt adhesive composition and process employing same
US4141774A · kind A · utility
4Cited by
6References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 1977 |
| Grant date | Feb 27, 1979 |
| Priority date | — |
| Expiry date | Jun 16, 1997 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31739
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A hot-melt adhesive composition containing a methoxymethylated terpolymer prepared from the corresponding terpolymer that is soluble in lower alcohols and contains a higher nylon salt or an .omega.-amino acid, or a lactam, each of which has more than 10 carbon atoms, and wherein the methoxymethylation ratio of the nylon copolymer is in the range of 10 to 30%.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.