Patent · US Expired

Method for contacting contact areas located on semiconductor bodies

US4142288A · kind A · utility

49Cited by

4References

8Claims

0Family size

Assignee

Licentia Patent-Verwaltungs-GmbH · DE

Inventors

Wieland Flammer · Cleebronn, DE
Roland Weber · Munich, DE
Gerhard Weiher · Brackenheim, DE
Jakob Troner · Heilbronn, DE

Key dates

Filing date	Feb 24, 1977
Grant date	Mar 6, 1979
Priority date	—
Expiry date	Feb 24, 1997

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49208
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of contacting metallic contact areas located on semiconductor bodies comprises passing wires through capillary openings into contact with the connecting contacts and fixing them thereto, severing the wires at predetermined distance from the contact areas and bending the separated wires to enable them to be connected to further connecting parts. The invention also includes a device suitable for carrying out this method.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.