Electroless gold plating baths
US4142902A · kind A · utility
5Cited by
1References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 9, 1978 |
| Grant date | Mar 6, 1979 |
| Priority date | — |
| Expiry date | Jan 9, 1998 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/44
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Improved electroless gold plating baths, free of cyanide ion, comprise an alkaline aqueous solution of a soluble gold (III) salt and an ether substituted tertiary amine borane. Metallic and non-metallic substrates having catalytically activated surfaces are plated by immersing the substrate in the plating bath.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.