Glass-encapsulated semiconductor device containing cylindrical stack of semiconductor pellets
US4148056A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 22, 1977 |
| Grant date | Apr 3, 1979 |
| Priority date | — |
| Expiry date | Jun 22, 1997 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A glass-encapsulated semiconductor device characterized in that a rectifier unit comprises a lamination of electrically series-connected and mechanically bonded semiconductor pellets and an electric-conductive spacer, and a pair of electrodes with external lead wires which are electrically connected and mechanically bonded with said lamination by means of soldering materials, the peripheral surface of the rectifier unit is covered with a protective glass layer over the entire length from one of the electrodes to the other, said conductive spacer having such a thickness that the thermal expansion coefficient of said spacer may be equal to the average thermal expansion coefficient of a virtual laminated column of said semiconductor pellets alone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.