Electroless plating
US4150171A · kind A · utility
16Cited by
8References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 5, 1978 |
| Grant date | Apr 17, 1979 |
| Priority date | — |
| Expiry date | Apr 5, 1998 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/208
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Dielectric or non-conductive substrates are electrolessly plated by contacting the surface of the substrate with aqueous solutions containing stannous and copper ions, the solutions being alternatively combined with a single solution, followed by contacting the surface of the substrate with a reducing agent capable of reducing the valence state of the copper ions. Systems of solutions useful in the practice of the aforesaid process are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.