High temperature adhesive made by exposure to radiation
US4151057A · kind A · utility
50Cited by
6References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 14, 1978 |
| Grant date | Apr 24, 1979 |
| Priority date | — |
| Expiry date | Aug 14, 1998 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31884
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A cured adhesive composition possessing excellent cohesive strength at high temperatures along with excellent shear strength and solvent resistance is prepared by the electron beam initiated curing of an adhesive composition comprising selectively hydrogenated monoalkenyl arene/conjugated diene block copolymer component, tackifying resin and a di-to-tetra-functional acrylate or methacrylate selected from the group consisting of acrylic and methacrylic acid esters of polyols.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.