Dip component lead cut and clinch apparatus
US4151637A · kind A · utility
39Cited by
7References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 7, 1978 |
| Grant date | May 1, 1979 |
| Priority date | — |
| Expiry date | Feb 7, 1998 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53065
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for simultaneously cutting and clinching both parallel rows of leads of DIP type electronic components. The apparatus operating adjacent the undersurface of a printed circuit board into which component leads have been inserted includes a cutter capable of clinching the lead rows either inward toward each other or outward.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.