Automated hybrid circuit board assembly apparatus
US4151945A · kind A · utility
51Cited by
8References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 8, 1977 |
| Grant date | May 1, 1979 |
| Priority date | — |
| Expiry date | Dec 8, 1997 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for placement of electronic components on a fluxed hybrid circuit substrate. In accordance with an automated program, the apparatus at a single work station places with high precision a plurality of chips of various types and physical and electrical sizes on a single substrate. Components are successively placed by a pair of hollow pick and placement spindles operating alternately and having motion in the X-Y planes. Precise location of stored chips is not required; the apparatus orients and centers each chip after selection and prior to placement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.