Electroless nickel plating
US4152164A · kind A · utility
Inventors
Key dates
| Filing date | Oct 21, 1976 |
| Grant date | May 1, 1979 |
| Priority date | — |
| Expiry date | Oct 21, 1996 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/1617
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This invention relates to electroless metal deposition and more specifically, to a process where a plating solution is brought to equilibrium and thereafter operated with the concentration of plating reactants and by-products maintained substantially constant. The plating solution treated in accordance with the invention is one having evaporative losses of at least one percent per plating cycle. Following the process, a plating solution can be operated indefinitely and yields a metal plate of uniform quality and predictable properties at any time during use of the solution. The invention avoids the known problems of by-product build-up and variable concentration of reactants typically associated with the use of such solutions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.