Printed circuit board and method for making the same
US4152477A · kind A · utility
36Cited by
6References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 17, 1977 |
| Grant date | May 1, 1979 |
| Priority date | — |
| Expiry date | Jan 17, 1997 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/254
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A printed circuit board made by providing on an insulating substrate an adhesive coating comprising a butadiene-based rubber and a phenolic resin finely dispersed therein, etching the surface layer of said coating with an oxidizing agent to expose the microcapsules having phenolic resin shells, which have been formed during the setting of said adhesive coating, and forming a chemically deposited metal layer on said adhesive coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.