Enhanced tube inner surface heat transfer device and method
US4154293A · kind A · utility
5Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 1976 |
| Grant date | May 15, 1979 |
| Priority date | — |
| Expiry date | Sep 9, 1996 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12104
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An inner surface substrate of metal tubes is provided with a single layer of randomly distributed metal bodies bonded to the substrate, spaced from each other, and substantially surrounded by the substrate to form body void space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.