Packaging assembly for electronic mechanism
US4159505A · kind A · utility
8Cited by
7References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 1977 |
| Grant date | Jun 26, 1979 |
| Priority date | — |
| Expiry date | Jun 16, 1997 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10962
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A package assembly for an electronic mechanism includes a housing which receives an electronic circuit board. Studs carried by the housing are connected to the circuit board by a flexible mechanism so that vibrations are dampened and thermal expansion of the connecting mechanism is accommodated. The connecting mechanism not only supports the circuit board within the housing, but also provides an electrical connection between the terminals on the circuit board and the studs, to which the electrical leads are installed which connect the package to other electronic components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.