Multilayer printed wiring board
US4159508A · kind A · utility
1Cited by
3References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 15, 1976 |
| Grant date | Jun 26, 1979 |
| Priority date | — |
| Expiry date | Dec 15, 1996 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/175
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This application discloses a multilayer printed wiring board having a plurality of pattern layers. Said printed wiring board has at least one pair of plated through holes, i.e. a first and a second plated through hole. The first plated through hole is directly connected to said patterns. The second plated through hole is not directly connected to said patterns. An electronic element terminal is connected to said second plated through hole. The first and second plated through holes are electrically connected to each other on a surface opposite an element mounting surface of the printed wiring board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.