Nickel plating
US4159926A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 1977 |
| Grant date | Jul 3, 1979 |
| Priority date | — |
| Expiry date | Nov 30, 1997 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A nickel electroplating bath comprises in aqueous solution at a pH of from 4 to 7, nickel ions at a Molar concentration of at least 0.25, chloride ions at a Molar concentration of at least 0.25, and a weak complexant for the nickel selected from formate, acetate, citrate, glutamate, anions and lactones of sugar acids and anions and lactones of acids having the formula X(C.sub.n H.sub.2n)COOH where X is OH or NH.sub.2 and n is 1 to 5, preferably 1 to 2, present at a Molar concentration of from 0.5 to 4.0 times that of the nickel. These baths have good throwing power and can be operated at convenient temperatures and pH values and at lower nickel ion concentrations than hitherto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.