Polyimide resin-forming composition
US4161477A · kind A · utility
25Cited by
4References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 8, 1976 |
| Grant date | Jul 17, 1979 |
| Priority date | — |
| Expiry date | Apr 8, 1996 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J179/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Polyimides of the formula ##STR1## Methods of making and polymerizing precursors for such polymers. Coating and adhesive compositions including constituents which can be converted into polyimides with the foregoing structure. Methods of making and using the compositions. Adhesion promoters for such compositions which are reaction products of aromatic dianhydrides and cyclic oxoimines, and methods of producing and using the adhesion promoters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.