Mechanisms for controlling temperature and heat balance of molds
US4162700A · kind A · utility
Inventor
Key dates
| Filing date | Oct 31, 1977 |
| Grant date | Jul 31, 1979 |
| Priority date | — |
| Expiry date | Oct 31, 1997 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22D27/04
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
This disclosure covers a process and mechanisms for controlling the temperature and heat balance of molds. More particularly, this invention relates to molds with built-in devices for heating and cooling various regions within molds. These devices are so constructed that each device is capable of heating and cooling independent of the other devices. The intensity of heating and cooling of these devices can be varied by regulating the flow of the heating/cooling medium in impulses for variable intervals of time. Prior to filling of the mold, the mold is heated to the desired working temperature by injecting a heated medium into the various heating/cooling devices. During or immediately after filling the mold, the flow of the heated medium to the device furthest from the casting riser (feeder) is discontinued and is replaced by a flow of cooling medium. When the material within the mold in the immediate vicinity of this device is solidified, the flow of cooling medium to this device is decreased or stopped. The remaining heating/cooling devices are then sequentially activated in the same manner as the first with activation occurring in a direction toward the casting riser. Thus, soli…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.