Patent · US Expired

Extrusion tool

US4163641A · kind A · utility

2Cited by
4References
5Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 26, 1978
Grant dateAug 7, 1979
Priority date
Expiry dateJun 26, 1998

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB29C48/12
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

An extrusion tool consisting of a stack of thin metal wafers in which apertures have been machined by chemical etching. Each wafer has one or several apertures. For simple profiles the wafers are identical. The apertures in adjacent wafers are angularly offset one with respect of the other for helical extrusion.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.