Thin film resistor having a thin layer of resistive metal of a nickel, chromium, gold alloy
US4164607A · kind A · utility
22Cited by
6References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 4, 1977 |
| Grant date | Aug 14, 1979 |
| Priority date | — |
| Expiry date | Apr 4, 1997 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
High stability thin film resistors are made from an alloy comprising selected portions of nickel, chromium, and gold selected in a ratio to provide the desired temperature coefficient of resistance (TCR). The resistors are made by co-depositing gold with the nickel chromium alloy by a flash evaporation process. The evaporation process is carried out by feeding a nickel chromium wire, having a gold wire extending therealong to provide the desired composition, onto a heated tungsten strip within a vacuum system with substrates disposed in a position to obtain uniform deposition of the evaporated material thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.