Apparatus for trimming and securing electronic components inserted into a printed circuit substrate
US4165557A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 1977 |
| Grant date | Aug 28, 1979 |
| Priority date | — |
| Expiry date | Dec 13, 1997 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/515
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for trimming and securing parallel lead electronic components inserted in a printed circuit substrate is provided. The apparatus includes a selectively rotatable driving assembly selectively displaceable towards an electronic component inserted into a printed circuit substrate, a lead bending assembly mounted on the driving assembly for bending the leads, and a cutting assembly mounted on the bending assembly for cutting the leads, the bending and cutting assemblies actuated by displacement of the driving assembly. The apparatus may include a sub-assembly for disposal of chips removed from the leads during cutting and a detection sub-assembly for detecting the presence of an inserted electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.