Method for producing lateral bipolar transistor by ion-implantation and controlled temperature treatment
US4167425A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 24, 1978 |
| Grant date | Sep 11, 1979 |
| Priority date | — |
| Expiry date | Apr 24, 1998 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D10/60
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lateral bipolar transistor has a semiconductor substrate of first conductivity type with an epitaxial layer arranged thereon of second conductivity type. Collector and emitter zones of first conductivity type are laterally arranged in the epitaxial layer. A base terminal contact zone connects with the epitaxial layer and a buried layer of second conductivity type is placed in the epitaxial layer below the emitter and collector zones. The buried layer has a doping concentration higher than the epitaxial layer so that a minority carrier current emanating from the emitter zone in a vertical direction is minimized. A doping profile of the emitter zone and portions of the base adjacent thereto is provided such that an additional potential barrier is created adjacent to and directly beneath the emitter zone in order to further minimize minority charge carriers emanating at a vertical direction from the emitter zone. The doping profile does not create any additional potential barrier in a lateral direction with respect to the emitter zone and the emanation of minority carriers from the emitter zone in a lateral direction is substantially uneffected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.