Method of making a thin film thermal print head
US4169032A · kind A · utility
13Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 1978 |
| Grant date | Sep 25, 1979 |
| Priority date | — |
| Expiry date | May 24, 1998 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/3359
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A thin film thermal print head is fabricated using radio frequency (rf) or direct current (DC) sputtering within a vacuum chamber into which is introduced a partial pressure of argon and nitrogen. Without breaking the vacuum, three consecutive layers comprising respectively tantalum nitride, gold, and tantalum nitride are sputter deposited and a diffusion barrier formed on a glazed substrate material. After these steps the desired land patterns are formed by photo lithographic techniques and chemical etching and finally sealant and abrasion resistant coatings are applied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.