Method and holding fixture for soldering lead frames to hybrid substrates
US4170326A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 9, 1978 |
| Grant date | Oct 9, 1979 |
| Priority date | — |
| Expiry date | Jan 9, 1998 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10924
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A fixture is provided for holding a hybrid substrate having a plurality of components already soldered to conductive patterns and/or lands on the front side thereof and having fingers of a lead frame pressed over one edge thereof for dip soldering lead frame fingers to lands. The fixture comprises a flat plate having a plurality of titanium clips or hook elements extending below the bottom edge of the plate, assembled hybrid substrates being loaded into the fixture with the base of the lead frame resting on the hooks. Slots cut in the front of the plate define a rib that extends over the length of the plate near the bottom edge. The rib contacts the backside of a substrate to form an air gap that prevents flux and solder wicking up it. A hinged cover rests against components on a substrate to hold the latter in place. Only the hook ends of the titanium clips, the lead frame, and a portion of the substrate adjacent the one edge are dipped into molten solder to solder lead fingers to associated lands. A two-piece mounting assembly on one side of the plate provides adjustment for making the one edge of the substrate and base of the lead frame parallel to the surface of the solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.