Method of making conductive via holes in printed circuit boards
US4170819A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 10, 1978 |
| Grant date | Oct 16, 1979 |
| Priority date | — |
| Expiry date | Apr 10, 1998 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49167
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board is provided with via holes and these holes are provided with a base coat of conductive metal, a coating of insulating material deposited on said base coat, and a second coat of conducting metal deposited on said insulating material. The metal coatings are interconnected to one or more surfaces of the board and the base coat is connected to at least one internal power, ground or signal plane. This via hole construction facilitates the making of engineering changes by simply deleting the interconnection between the metal coatings at the board surface and subsequently connecting the desired point to an alternate point on the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.