Wafer packaging system

US4171740A · kind A · utility

Assignee

• Monsanto Company · US

Inventors

• Carl J. Clement · Los Altos Hills, US
• Kenneth S. Campbell · Mountain View, US
• Fred H. Stengel · Palo Alto, US

Key dates

• Filing date: Nov 3, 1978
• Grant date: Oct 23, 1979
• Expiry date: Nov 3, 1998

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67383
• WIPO field: Handling
• WIPO sector: Mechanical engineering

Abstract

A wafer packaging system for clean packaging and damage-free transporting of semiconductor wafers. The system includes tubular outer and inner containers, the inner container adapted to be contained by the outer container with the longitudinal axes of both containers extending in the same axial direction. The inner container includes provision for holding a plurality of the semiconductor wafers in spaced face-to-face relationship. The system provides a sealed container arrangement preventing contaminants outside the outer container from contaminating wafers within the inner container. Shock-absorbing features associated with the containers prevent shocks applied to the outer container from damaging the wafers.