Method for glueing with curable, formaldehyde-based adhesives and a curing composition for use in the method
US4175065A · kind A · utility
11Cited by
2References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 12, 1978 |
| Grant date | Nov 20, 1979 |
| Priority date | — |
| Expiry date | May 12, 1998 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/662
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A hardener composition for precondensates or liquid resins containing resorcinol and formaldehyde or resorcinol-phenol and formaldehyde and a method for glueing by using them. The hardener composition contains powdered paraformaldehyde suspended in a suspending agent that includes a precondensate of ketone and formaldehyde, which precondensate preferably contains water as a dilution media.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.