Apparatus and method for affixing bondable finger contacts to a printed circuit board
US4178678A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 1978 |
| Grant date | Dec 18, 1979 |
| Priority date | — |
| Expiry date | Mar 28, 1998 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1322
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Apparatus and a method are disclosed for affixing bondable finger contacts (102) to a printed circuit board (330). The bondable finger contacts, as supplied, are wound on a reel (301) in a virtually continuous fashion. Each of the contacts is carried between a pair of attached support carriers (105 and 106). At a first station the support carriers are severed (305, 306, 307, 313, 314 and 315) from a selected group of contacts but these contacts remain interconnected and supported by a strip of protective adhesive tape (108). Thereafter the contacts are transferred (310, 311 and 312) to a second station where they are brought into engagement with an aligned printed circuit board (331, 332, 333, 334 and 337). Application of heat and pressure to thermally curable adhesive (109) on the contacts bonds (335, 336 and 339) the contacts to the circuit board. During these operations the protective tape covers the contact area thereby reducing the possibility of contact area contamination and damage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.