Method for rendering non-platable surfaces platable
US4181760A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 6, 1977 |
| Grant date | Jan 1, 1980 |
| Priority date | — |
| Expiry date | Jun 6, 1997 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/245
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process is described for the reception of electroless plating onto a non-catalytic metal or alloy substrate, non-catalytic to conventional electroless plating. The process comprises contacting the non-catalytic substrate with a promoter composition comprising ions selected from the group consisting of nickel, cobalt, iron and mixtures thereof; and a suitable reducing agent capable of chemically interacting with the non-catalytic metal or alloy and the metal ions in the promoter composition and further wherein the relative concentration of the reducing agent to metal ions is so adjusted as to yield first a reaction of the reducing agent with the non-catalytic metal or alloy and thereafter a heterogeneous reduction of the metal ions; and thereafter contacting the treated substrate with a conventional electroless plating bath, e.g, a nickel or cobalt-hypophosphite type bath or a copper-formaldehyde type bath for the metallic build-up.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.