Apparatus for plating a layer onto a metal strip
US4183799A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 1978 |
| Grant date | Jan 15, 1980 |
| Priority date | — |
| Expiry date | Aug 31, 1998 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S204/07
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An improvement in a device for plating a thin layer of a first metal onto the surface of a generally flat metal strip formed of a second metal as the strip is moving in a selected direction along a given path, wherein the device includes an anode in the chamber and means for supplying electrolyte containing ions of the first metal between the anode and the moving strip. The improvement involves providing the anode as an electrically conductive, non-consumable, anode element having an outer surface with a transverse width substantially as great as the width of the strip. A plenum chamber is formed behind the anode element and generally coextensive with the outer surface of the element so that apertures in the anode element direct jets of electrolyte through the anode element and directly against the surface being plated to provide a uniformly turbulent flow of electrolyte at the surface of the strip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.