Patent · US Expired

Process for multiple lap cutting of solid materials

US4187827A · kind A · utility

4Cited by

3References

4Claims

0Family size

Assignee

Wacker-Chemitronic fur Elektronic Grundstoffe mbH · DE

Inventors

Dieter Regler · Burghausen, DE
Erhard Sitrl · Marktl, DE
Alfred Moritz · Burghausen, DE

Key dates

Filing date	May 3, 1978
Grant date	Feb 12, 1980
Priority date	—
Expiry date	May 3, 1998

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB28D5/042
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

A process for the multiple lap cutting of solid materials, using a set of parallel, spaced apart blades mounted on the frame of a gang-saw for reciprocal movement over the solid materials to be cut, in a suspension of a lapping abrasive, wherein a pressure of from 100 to 1,000 gf per blade is exerted on the solid material, the free working length of the blades is held between 110 to 250 mm, and wherein the pressure applied to the blades is inversely proportional to the length of the blades, and the blades move through the solid material at a mean lateral speed of from 30 to 150 meters per minute.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.