Oxygen atom containing film for a thin-film electroluminescent element
US4188565A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 8, 1978 |
| Grant date | Feb 12, 1980 |
| Priority date | — |
| Expiry date | Mar 8, 1998 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B33/22
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
At least one silicon-oxynitride film is deposited on an electroluminescence layer for providing a uniform and stable dielectric layer for an electroluminescence display panel. The silicon-oxynitride film is deposited using a sputtering technique by mixing a small amount (1 mol%) of nitrous oxide (N.sub.2 O) gas into a sputtering gas such as nitrogen (N.sub.2) gas. Oxygen (O.sub.2) gas may be substituted for the N.sub.2 O gas mingled within the sputtering gas in the amount of five mol%. A target for sputtering is a pure silicon or sintered Si.sub.3 N.sub.4 plate. An R.F. discharge is provided so that the power flux density on the target becomes several to several ten W. The silicon-oxynitride film is derived by means of the reaction between ion sputtering and the sputtering gas. A dielectric layer is further provided for establishing high reliabiltiy high dielectric properties of the electroluminescence display panel, the dielectric layer being disposed together with the silicon-oxynitride film and being one of the group consisting of Al.sub.2 O.sub.3, SiO.sub.2, Ta.sub.2 O.sub.5, Si.sub.3 N.sub.4 and Y.sub.2 O.sub.3. The silicon-oxynitride flm which is injected by suitable ions suc…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.