Semiconductor device having bump terminal electrodes
US4188636A · kind A · utility
36Cited by
7References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 29, 1978 |
| Grant date | Feb 12, 1980 |
| Priority date | — |
| Expiry date | Mar 29, 1998 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is disclosed in which a protrusion is interposed between a bump terminal electrode and the peripheral edge of the semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.