Baking finishes of low solvent content

US4190569A · kind A · utility

Assignee

• BASF SE

Inventors

• Ruprecht Kroker · Frankenthal (Pfalz), DE
• Hans Sander · Ludwigshafen, DE
• Hermann Gausepohl · Mutterstadt, DE

Key dates

• Filing date: Sep 6, 1978
• Grant date: Feb 26, 1980
• Expiry date: Sep 6, 1998

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L63/00
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

The invention relates to baking finishes of low solvent content, consisting essentially of an acrylate resin, an eposy resin and a mixture of organic solvents, with or without pigment, catalyst and other conventional auxiliaries, in which the acrylate resin is a copolymer which contains from 10 to 35% by weight of .alpha.,.beta.-olefinically unsaturated carboxylic acids as copolymerized units, has a very low K value and has an acid number of from 70 to 250 mg of KOH/g, the epoxy resin contains at least 2 oxirane groups per molecule and the mixture of organic solvents is a mixture of from 20 to 80% by weight of a solvent having a boiling point of from 100.degree. to 280.degree. C. and a dielectric constant of from 2 to 4.99, and from 80 to 20% by weight of a solvent having a boiling point of from 80.degree. to 200.degree. C. and a dielectric constant of from 5 to 27. The weight ratio of acrylate resin to epoxy resin is from 9:1 to 6:4. The acrylate resin has a mean molecular weight Mn of from 1500 to 3000 and an inhomogeneity (Mw/Mn), measured by gel permeation chromatography, of from 1.5 to 2.0. These baking finishes of low solvent content may be used, e.g., as finishes for domesti…