Multi-layer dielectric structure
US4193082A · kind A · utility
14Cited by
2References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 23, 1978 |
| Grant date | Mar 11, 1980 |
| Priority date | — |
| Expiry date | Jun 23, 1998 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The coating of a conductor pattern on dielectric green sheets to a common edge thereof with stacking or superimpositioning together of a plurality of sheets to enclose the conductor pattern followed by sintering, with the edge side of the fired body having the exposed end terminations becoming the actual face of the body on which a semiconductor device is mounted in electrical circuit connection to respective ones of the common end terminations of the conductor runs. The opposite or distal ends of the conductor runs may be fanned out to the opposite edge of side of the fired body in increased spaced relationship to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.