Method for making a raw board for use in printed circuits
US4193849A · kind A · utility
30Cited by
2References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 15, 1978 |
| Grant date | Mar 18, 1980 |
| Priority date | — |
| Expiry date | Mar 15, 1998 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/146
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There is disclosed a method of making a raw board for use in printed circuits, comprising the steps of subjecting a film of a plastic to vapor deposition with a metal and then electrochemically depositing a metal on the metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.