Cathode for sputtering
US4194962A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 1978 |
| Grant date | Mar 25, 1980 |
| Priority date | — |
| Expiry date | Dec 20, 1998 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3408
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A system for sputter coating architectural glass is disclosed which includes an evacuable enclosure, a conveyor for moving glass to be coated along parallel paths, an elongated sputtering cathode supported between the paths, and structure by which ionizable gas is introduced into the enclosure. The cathode creates a continuous band of plasma extending about it through a region defining laterally spaced first and second sections extending generally parallel to glass on respective sides of the cathode and return sections joining the ends of the laterally spaced sections. The cathode includes sputtering material target face portions extending adjacent and parallel to the plasma sections and a magnetic field directing system for constraining the plasma flow in the sections to extend substantially uniformly over the target face portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.