Semiconductor device subassembly and manufacture thereof
US4196309A · kind A · utility
1Cited by
2References
10Claims
0Family size
Inventor
Key dates
| Filing date | Jan 30, 1978 |
| Grant date | Apr 1, 1980 |
| Priority date | — |
| Expiry date | Jan 30, 1998 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device subassembly of an elongated conductive lead member, a refractory metal slug and a brazing disk is constructed by mechanically securing the slug to the lead member, assembling the brazing disc to contact both the slug and the lead member and thereafter brazing the slug and the lead member together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.