Semiconductor device
US4196442A · kind A · utility
19Cited by
2References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 1978 |
| Grant date | Apr 1, 1980 |
| Priority date | — |
| Expiry date | May 31, 1998 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device comprises a semiconductor substrate and at least one supporting electrode soldered to one surface of the semiconductor substrate. The supporting electrode is constituted by a composite body having fibers embedded in a matrix of an electrically conductive metal. The coefficient of the thermal expansion of the fibers is substantially equal to or smaller than that of the semiconductor substrate. The fiber is arrayed in an annular, circular, spiral or the like pattern at least in the surface portion of the composite body on which the composite body is bonded to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.