Method for providing substantially hermetic sealing means for electronic components
US4198444A · kind A · utility
11Cited by
24References
25Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 22, 1978 |
| Grant date | Apr 15, 1980 |
| Priority date | — |
| Expiry date | Nov 22, 1998 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10156
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A glass layer is preferably chemically vapor deposited on a suitable polymer layer of protective coating material to provide an hermetic encapsulation means for a semiconductor element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.