Process for sensitizing articles for metallization and resulting articles
US4199623A · kind A · utility
20Cited by
11References
45Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 1977 |
| Grant date | Apr 22, 1980 |
| Priority date | — |
| Expiry date | May 13, 1997 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/1893
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Surfaces of articles are sensitized for the deposition of adherent metal from electroless metal solutions in contact therewith by prior treatment with an activatable complex of copper in a liquid medium formed from a solution comprising a mixture of halogen, cuprous and cupric components and thereafter forming a deposit on the treated article surfaces of a water-insoluble derivative of the said complex. Such surface deposits are treated with a reducing agent or water to enhance their reception of metal in an electroless metal deposition bath.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.