Cold damping of mechanical structures
US4199989A · kind A · utility
8Cited by
4References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 1978 |
| Grant date | Apr 29, 1980 |
| Priority date | — |
| Expiry date | Sep 18, 1998 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16F15/02
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
Methods and apparatus are disclosed for substantially reducing the effect of the inherent transducer capacitance in a transducer-coupled electromechanical system which is subject to vibrational movement. First and second electromechanical transducers, mechanically coupled to the mechanical structure are interconnected by an electronic feedback network. The feedback network is characterized by very low input and output impedances thus overcoming the shunting effects of the inherent transducer capacitance. In preferred embodiments the feedback network is "electronically cooled" thereby providing low-noise damping.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.