Hot melt adhesive foam pump system
US4200207A · kind A · utility
50Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 1, 1978 |
| Grant date | Apr 29, 1980 |
| Priority date | — |
| Expiry date | Feb 1, 1998 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB01F2101/36
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A hot melt adhesive foam pump system having a first stage pump that meters molten hot melt adhesive into a second stage pump, which in turn mixes gas under pressure into the adhesive so that the gas is driven into solution with the adhesive at an adjustably controllable ratio. The pump is insensitive to changes in adhesive viscosity and pump speed, and provides uniformity of foam density and output flow rate when the adhesive is ejected from a dispenser connected to the pump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.