Patent · US Expired

Ultrasonic soldering bath having an ultrasonic probe extending into the solder bath

US4203531A · kind A · utility

15Cited by

6References

8Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Hilmar Reichel · Planegg, DE
Guenter Klauke · Munich, DE
Karl-Heinz Herting · Munich, DE
Martin Pointner

Key dates

Filing date	Jun 8, 1978
Grant date	May 20, 1980
Priority date	—
Expiry date	Jun 8, 1998

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K3/0661
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

An ultrasonic soldering device having a container to hold a bath of molten solder, at least one ultrasonic transducer for creating an ultrasonic wave, a probe connected to each of the transducers and means for mounting the probe to extend through a wall of the container such as a bottom wall into the bath characterized by the mounting including means for increasing and decreasing the amount of probe extending into the bath so that the end of the probe can be adjusted relative to the bath surface. Preferably, a soldering device is a so-called lift solder bath having a hermetically sealed lid provided with a shaft in which the level of bath can be raised or lifted and the probe is mounted to extend into the shaft so that as the level of solder rises in the shaft, the end of the probe can be adjusted to be just beneath the level.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.